|
|
|
11.07.26 - 14:06
|
These 5 Chip Stocks Are Riding the AI Fab Spending Wave (24/7 Wall St.)
|
|
|
Applied Materials just blew past its own growth forecast, and the companies supplying every HBM stack and gate-all-around node are collecting the checks. Five picks-and-shovels stocks sit directly under that spending fire hose, and the one most retail investors cannot name is leading the pack....
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
08.07.26 - 21:00
|
Every Memory Stock Is Now in a Bear Market: Is Micron, SanDisk, or Applied Materials the Best Buy? (24/7 Wall St.)
|
|
|
The memory-chip complex has sold off hard from recent peaks. In light of this, investors are asking which of Micron Technology (NASDAQ:MU), SanDisk (NASDAQ:SNDK), or Applied Materials (NASDAQ:AMAT) they should actually own after the drawdown. According to Carson Group chief market strategist Ryan Detrick, from recent highs Micron stock is down 22%, Applied Materials stock ... Every Memory Stock Is Now in a Bear Market: Is Micron, SanDisk, or Applied Materials the Best Buy?...
|
|
|
|
|
|
|
|
|
07.07.26 - 16:30
|
Intel and Applied Materials Dive 10%, AMD Craters 8% as Samsung Earnings Trigger Chip Selloff (24/7 Wall St.)
|
|
|
Shares of Intel (NASDAQ:INTC) are down 10% in Tuesday morning trading to $110, while Advanced Micro Devices (NASDAQ:AMD) stock is off 8% to $508. The moves cap a sharp reversal after both names rallied Monday. The declines are part of a broader chip selloff triggered by Samsung Electronics' quarterly report. Equipment maker Applied Materials (NASDAQ:AMAT) ... Intel and Applied Materials Dive 10%, AMD Craters 8% as Samsung Earnings Trigger Chip Selloff...
|
|
|
|
|
|
|
|
|
|
|
05.07.26 - 04:54
|
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up (Digitimes)
|
|
|
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth memory (HBM), chiplet architectures, and multi-layer 3D stacking on advanced production lines....
|
|
|
|
|
|
Börsentreff auf Facebook |
Börsentreff auf X |
Börsentreff auf Instagram
